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ISES USA 2024
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April 2nd
April 3rd
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Industry Topics
Advanced Packaging
Artificial Intelligence
Memory Manufacturing
5G Networking
Supply Chain
Automotive Electronics
Event Type
Keynote
Panel
Networking
Buffet Lunch
Dinner
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07:00 – 08:15
Registration
08:15 – 08:30
08:35 – 08:55
Headline Address
Greater Phoenix: Semiconductor Excellence on the Global Stage
09:00 – 09:30
09:35 – 10:05
Keynote
Packaging: then, now and in the future
10:10 – 11:10
Networking Break & Business Meetings 1+2
11:15 – 11:45
Keynote
HPC, AI, Chiplets, heterogeneous integration
11:50 – 12:10
Speaker
Optimizing Interconnect Density with New Packaging Technologies
12:15 – 12:35
Speaker
Silicon Manufacturing and Packaging at MSFT in the Cloud/AI era
12:40 – 13:55
Buffet Lunch
14:00 – 14:20
Speaker
Optimizing Cost and Quality Through Test Mobility Across Insertions
14:25 – 14:45
14:50 – 15:50
Networking Break & Business Meetings 3+4
15:55 – 16:10
Speaker
Challenges to enabling the transition from organic to glass core substrates as RDL approaches 2 µm l/s and beyond
16:15 – 16:25
Speaker
Co-Packaged Optics and Solutions for High Volume manufacturing
16:30 – 16:40
Speaker
Glass Substrates for Advanced Packaging
16:45 – 17:30
Panel Session
THE ROLE OF MEMORY IN HPC & AI IN THE ERA OF CHIPLETS
18:00 – 19:00
Cocktail Reception
SPONSORED BY GTI (Green Technology Investments)
19:00 – 21:00
07:55 – 08:25
Registration
08:30 – 08:50
08:55 – 09:15
Speaker
Advanced Packaging and Disaggregated Architectures for Automotive
09:20 – 09:30
Speaker
Advanced Packaging/Substrate Materials and Open innovation Platform
09:35 – 09:45
Speaker
Enabling the Next Generation of Scaling for Advanced Substrates
09:50 – 10:10
Speaker
New Process as Solutions for Substrates Production
10:15 – 11:15
Networking Break and Business Meetings 5+6
11:20 –11:40
Speaker
Semiconductor Market Outlook: Investment and Innovation Accelerate Next Growth Cycle
11:45 – 12:20
Panel Session
THE FUTURE OF SILICON PHOTONICS
12:25 – 13:40
Buffet Lunch
13:45 –13:55
Speaker
A Game-Changer for AI and HPC Substrates: A Novel Interconnect Technology
14:00 – 14:35
Panel Session
SUPPLY CHAIN RESILIENCY PANEL
14:40 – 15:40
Networking Break and Business Meetings 7
15:45 – 15:55
16:00 – 16:45
Panel Session
BRIDGING WORKFORCE, RESEARCH AND BUSINESS TO MEET THE FUTURE NEEDS OF THE U.S. PANEL SESSION