Agenda

Speakers

Dr. Mike

Slessor

FormFactor

President & CEO

Michael D. Slessor has served as the Chief Executive Officer of FormFactor, Inc. since December 2014, and as a Director since October 2013. Mike served as President from October 2013 to December 27, 2014, and as Senior Vice President and General Manager, MicroProbe Product Group from October 2012 to October 2013. Before joining FormFactor, he was President and Chief Executive Officer of MicroProbe from July 2008 through the October 2012 closing of FormFactor’s acquisition of MicroProbe. Prior to joining MicroProbe, he held various management, product-marketing, and applications-engineering positions in the semiconductor industry, primarily with KLA-Tencor. Mike received his Ph.D. in Aeronautics and Physics from the California Institute of Technology and his B.A.Sc. in Engineering Physics from the University of British Columbia.

Michael D. Slessor has served as the Chief Executive Officer of FormFactor, Inc. since December 2014, and as a Director since October 2013. Mike served as President from October 2013 to December 27, 2014, and as Senior Vice President and General Manager, MicroProbe Product Group from October 2012 to October 2013. Before joining FormFactor, he was President and Chief Executive Officer of MicroProbe from July 2008 through the October 2012 closing of FormFactor’s acquisition of MicroProbe. Prior to joining MicroProbe, he held various management, product-marketing, and applications-engineering positions in the semiconductor industry, primarily with KLA-Tencor. Mike received his Ph.D. in Aeronautics and Physics from the California Institute of Technology and his B.A.Sc. in Engineering Physics from the University of British Columbia.

Upcoming Events

May 9th

 | 

17:20 – 17:30

Heading

Strategies for Probe in a Chiplet World

Wafer probe is taking a prominent role in enabling advanced-packaging schemes like the heterogenous integration of chiplets. This prominence is being driven by the need for high pre-assembly chiplet yields to ensure economically viable composite product yields, which is driving increased test coverage and capability at probe. In addition, chiplet-to-chiplet interconnect structures are at least an order of magnitude denser than traditional flip-chip interconnect, which can create additional technical complexity and cost at probe if not managed carefully. We'll look at a few of the tradeoffs between capability, coverage, and cost, to help enable this careful management.

Full Agenda

FormFactor

FormFactor, Inc. (NASDAQ:FORM), is a leading provider of essential test and measurement technologies along the full IC life cycle –from metrology and inspection, characterization, modeling, reliability, and design debug, to qualification and production test. Semiconductor companies rely upon FormFactor’s products and services to accelerate profitability by optimizing device performance and advancing yield knowledge. The Company serves customers through its network of facilities in Asia, Europe, and North America. For more information, visit the Company’s website atwww.formfactor.com.phone number: +1-925-290-4000

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