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Chee-Ping
Lee
Lam Research
Technical Director, Advanced Packaging Customer Operations
Lee Chee Ping is Technical Director for Lam Research, focusing on the advanced packaging segment. He has been in the semiconductor industry for more than 17 years with more than 11 years in advanced packaging. He now oversees a worldwide process team, engaging customers working on the advanced packaging market and technology area. Lee Chee Ping received his M.Eng in Technology Management from the University of South Australia, as well as both M.Sc in Financial Engineering and B.Eng in Chemical Engineering from National University of Singapore.
Lee Chee Ping is Technical Director for Lam Research, focusing on the advanced packaging segment. He has been in the semiconductor industry for more than 17 years with more than 11 years in advanced packaging. He now oversees a worldwide process team, engaging customers working on the advanced packaging market and technology area. Lee Chee Ping received his M.Eng in Technology Management from the University of South Australia, as well as both M.Sc in Financial Engineering and B.Eng in Chemical Engineering from National University of Singapore.
Upcoming Events
May 10th
|
15:35 – 15:40
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Heterogeneous Integration: enabling deposition and etch innovations
When it comes to integrated circuits (ICs), single-technology chips have been the industry standard approach. Generations of node scaling have crammed more components onto a chip, with amazing functionality, following Moore’s Law. However, the escalating cost of front end manufacturing associated with leading edge silicon technology has driven renewed focus on alternative approaches. Meet the next frontier: heterogenous integration (HI). HI brings multiple chips (or chiplets) together into a single package. It elevates conceptually similar multi-chip modules to the next level by leveraging advanced wafer manufacturing technologies. This presentation will introduce Lam Research, followed by an overview of innovative deposition and etch equipment solutions by Lam to enable next generation heterogeneous integration.
Full Agenda
Lam Research
Lam Research Corporation is a global supplier of innovative wafer fabrication equipment and services to the semiconductor industry. Lam’s equipment and services allow customers to build smaller and better performing devices. In fact, today, nearly every semiconductor chip is built with Lam technology. We combine superior systems engineering, technology leadership, and a strong values-based culture, with an unwavering commitment to our customers. Lam Research (Nasdaq: LRCX) is a FORTUNE 500® company headquartered in Fremont, Calif., with operations around the globe. Learn more at www.lamresearch.com. Lam Research Corporation Corporate Headquarters: 4650 Cushing Parkway Fremont, CA 94538 United States Telephone: +1-510-572-0200 Toll Free: +1-800-526-7678 Company Website: https://www.lamresearch.com/
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