Sriram is a Partner at Microsoft focusing on Packaging technologies, Signal/Power Integrity and Analog Power Delivery for Microsoft Azure and custom Products. Prior to that, he worked at Intel Corporation for 21 years on Substrate design, Advanced Packaging, Package Archiecture and technology pathfinding. His interest and focus have always been on Package architecture and technology definition with focus on silicon-package-platform co-design to deliver optimized product and technology. He holds B.Tech from University of Madras, India and M.S from University of Kansas, Lawrence.
Microsoft Azure is in it with massive infrastructure to support it. To enable an efficient and best performing cloud, End-to-End optimization is becoming more and more important. Being a platform and software company, Microsoft is investing into custom silicon to create the End-to-End solution stack. The talk with focus on Silicon, Packaging and Manufacturing aspects including challenges and technology enablers to create the optimal solution.