Rozalia
Beica
LQDX
Chief Commercial Officer

Rozalia is a distinguished leader in the Semiconductor and Advanced Packaging industry, with an impressive career of over 30 years. Her expertise encompasses a unique mix of broad cross-industry expertise, including electronic materials, substrates, equipment, device & system manufacturing, and market intelligence. Rozalia has held several executive roles across various functions, in technology development, strategic planning, business development, sales, marketing and operations and has been instrumental in the growth and success of industry powerhouses such as Rohm and Haas, Dow, DuPont, Semitool, Applied Materials, Lam Research, Maxim Integrated Products, Yole Developpement, and AT&S. Recently, Rozalia took on the role of Chief Commercial Officer at LQDX, where she is leading the company’s strategic direction and growth.

An active participant in industry activities, Rozalia led numerous symposiums globally, consortia activities, technical working groups and industry roadmaps activities. Rozalia served on the board of IEEE EPS, IMAPS and 3DinCites and currently she is a Member of the Advisory Board at IMPACT and Terecircuits.

Rozalia’s academic achievements include a M.Sc. in Chemical Engineering from Polytechnic University Timisoara, a M.Sc. in Management of Technology from KWU, and a Global Executive MBA from Instituto de Empresa University, in partnership with Brown University, Fudan University, and Insper University.

Upcoming Events
Speaker
I
Day 2
I
13:45 –13:55
A Game-Changer for AI and HPC Substrates: A Novel Interconnect Technology

The semiconductor industry is undergoing significant transformation due to advancements in artificial intelligence (AI) and high-performance computing (HPC). Key to this progress is the ability to meet high computational and memory requirements, which impacts the entire supply chain, including Advanced Packaging and IC substrates. Ultra-high density interconnects play a crucial role in enabling future AI accelerators and HPC systems. LQDX’s cutting-edge metallization technology, utilizing flexible and cost-effective wet processing, is a breakthrough solution for interconnects.

Regarding the Bio - on the website, it looks very good and short - thank you!  Just a small change, if possible, can you please add the other companies I worked for to the bio (Lam Research, Applied Materials, Yole Development and AT&S)? The bio mentions that I worked across different sectors in the industry, but then only the material companies are listed. It would be great to add at least the ones listed above.

LQDX

TBC