For more than 35 years, Keith Best has held a range of semiconductor processing and applications positions for both device manufacturing and capital equipment companies, of which 13 years were with ASML where he held the position of Director, Applications Engineering. Most recently, Keith was Advanced Packaging Process Development Engineering Manager at SkyWater Florida. He is currently the Director of Product Marketing, Lithography, at Onto Innovation supporting the JetStep® advanced packaging lithography stepper. Keith holds a B.Sc. Honors Degree in Materials Science from the University of Greenwich, UK. He has numerous publications and holds 22 US patents in the areas of photolithography and process integration.
For many years organic substates have provided the most cost effective solution to enable the heterogeneous integration of chiplets. However, as the substrate interconnect density increases, there has been a paradigm shift in the package architecture to replace organic substrates with glass core substrates. This talk will discuss the benefits and challenges of both architectures and explores the possibility of extending the useful life of organic substrates beyond 5 µm l/s.