Chris Bailey joined ArizonaState University in 2022 where is Professor of Advanced Semiconductor Packaging and Director of the Centre for Advanced Semiconductor Packaging. Prior to this, he was Professor of Computational Mechanics & Reliability and Associate Dean for Research at the University of Greenwich, UK. Chris has published 400+archival papers in electronics packaging and received $40M+ from Government and Industry to support his research activities. He is an associate editor for the IEEE Transactions of Components, Packaging, and Manufacturing Technology and co-chair for the Co-Design and Modelling & Simulation chapters for the Heterogeneous Integration Roadmap (HIR).